Integrated thermomechanical design and optimization of BGA packages using genetic algorithm

Hamid A. Hadim, Tohru Suwa

Research output: Contribution to conferencePaperpeer-review

2 Scopus citations

Abstract

A new multidisciplinary design and optimization methodology in electronics packaging is presented. A genetic algorithm combined with multi-disciplinary design and multi-physics analysis tools are used to optimize key design parameters. This methodology is developed to improve the electronic package design process by performing multidisciplinary design and optimization at an early design stage. To demonstrate its capability, the methodology is applied to a Ball Grid Array (BGA) package design. Multidisciplinary criteria including thermal, thermal strain, electromagnetic leakage, and cost are optimized simultaneously. A simplified routability analysis criterion is treated as a constraint. The genetic algorithm is used for systematic design optimization while reducing the total computational time. The present methodology can be applied to any electronics product design at any packaging level from the chip level to the system level.

Original languageEnglish
Pages495-502
Number of pages8
DOIs
StatePublished - 2004
EventProceedings of the ASME Heat Transfer/Fluids Engineering Summer Conference 2004, HT/FED 2004 - Charlotte, NC, United States
Duration: 11 Jul 200415 Jul 2004

Conference

ConferenceProceedings of the ASME Heat Transfer/Fluids Engineering Summer Conference 2004, HT/FED 2004
Country/TerritoryUnited States
CityCharlotte, NC
Period11/07/0415/07/04

Fingerprint

Dive into the research topics of 'Integrated thermomechanical design and optimization of BGA packages using genetic algorithm'. Together they form a unique fingerprint.

Cite this