@inproceedings{e4305271a7f74fd59b166356e62f2a64,
title = "Interfacial failure simulation of single solder joint using a multiscale approach",
abstract = "The interface damage of single solder joint was simulated using cohesive zone model incorporated in finite element analysis. In this study, the solder/IMC/Cu pad interfaces models were constructed for the molecular dynamics simulation. The traction-separation law was derived when the interface model was subjected to a principle strain in one direction. The materials properties of cohesive element for finite element analysis (FEA) were then extracted from the molecular dynamics (MD) calculations. The multiscale simulation results show that the interface damage can be captured well based on the cohesive zone model coupling with MD simulation results, particular when the brittle failure is the dominant mode at the interfaces of single solder joint.",
keywords = "Cohesive element, Finite element, Interface, Lead-free solder, Molecular dynamics",
author = "Feng Gao and Jianmin Qu and Liang, {Frank Z.} and Williams, {Richard L.}",
year = "2010",
doi = "10.1109/ITHERM.2010.5501276",
language = "English",
isbn = "9781424453429",
series = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",
booktitle = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010",
note = "2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 ; Conference date: 02-06-2010 Through 05-06-2010",
}