Interfacial failure simulation of single solder joint using a multiscale approach

Feng Gao, Jianmin Qu, Frank Z. Liang, Richard L. Williams

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The interface damage of single solder joint was simulated using cohesive zone model incorporated in finite element analysis. In this study, the solder/IMC/Cu pad interfaces models were constructed for the molecular dynamics simulation. The traction-separation law was derived when the interface model was subjected to a principle strain in one direction. The materials properties of cohesive element for finite element analysis (FEA) were then extracted from the molecular dynamics (MD) calculations. The multiscale simulation results show that the interface damage can be captured well based on the cohesive zone model coupling with MD simulation results, particular when the brittle failure is the dominant mode at the interfaces of single solder joint.

Original languageEnglish
Title of host publication2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
DOIs
StatePublished - 2010
Event2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 - Las Vegas, NV, United States
Duration: 2 Jun 20105 Jun 2010

Publication series

Name2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Conference

Conference2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
Country/TerritoryUnited States
CityLas Vegas, NV
Period2/06/105/06/10

Keywords

  • Cohesive element
  • Finite element
  • Interface
  • Lead-free solder
  • Molecular dynamics

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