Interfacial versus cohesive failure on polymer-metal interfaces in electronic packaging - Effects of interface roughness

Qizhou Yao, Jianmin Qu

Research output: Contribution to journalArticlepeer-review

74 Scopus citations

Abstract

Debonding of polymer-metal interfaces often involves both interfacial and cohesive failure. Since the cohesive strength of polymers is usually much greater than the polymer-metal interfacial strength, cohesive failure near the interface is usually desired for enhancing the interfacial adhesion. Roughened surfaces generally produce more cohesive failure; therefore, they are used commonly in practice to obtain better adhesion. This paper develops a fracture mechanics model that can be used to quantitatively predict the amount of cohesive failure once the surface roughness data are given. An epoxy/Al interface was investigated using this fracture mechanics model. The predicted amount of cohesive failure as a function of surface roughness compares very well with the experimentally measured values. It is believed that this model can be extended to other polymer-metal interfaces. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD.

Original languageEnglish
Pages (from-to)127-134
Number of pages8
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume124
Issue number2
DOIs
StatePublished - Jun 2002

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