@inproceedings{e6c034f64bbb4842a2e322a33f608e79,
title = "Large area processing using small area substrates: A low-cost MCM-D thin film processing",
abstract = "A palletization process incorporating several alumina or silicon tiles on a large carrier glass (pallet) has been explored to offer a low-cost MCM-D process. The multi-tiling format provides simultaneous processing of several small tiles onto a re-usable CTE matched carrier glass. Tiles are attached to the glass with a low modulus adhesive. The MCM-D thin film processes are to be performed on these tiles and finally the tiles are to be released from the carrier glass by thermal treatment. Results from this study indicate that the palletization concept can be utilized for high temperature (∼400 °C) MCM-D thin film process thus providing a low cost and large format MCM-D processing opportunity with the small area substrates.",
keywords = "Large format processing, Low-cost MCM, Palletization",
author = "Bhattacharya, {Swapan K.} and Sitaraman, {Suresh K.} and Ume, {I. Charles} and Jianmin Qu and Wong, {C. P.} and Baldwin, {Daniel F.} and Tummala, {Rao R.}",
year = "2001",
language = "English",
isbn = "0791835405",
series = "Advances in Electronic Packaging",
pages = "1443--1448",
booktitle = "Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging",
note = "Advances in Electronic Packaging ; Conference date: 08-07-2001 Through 13-07-2001",
}