Laser-Enhanced Electrodeposition of Lead-Tin Solder

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Abstract

Localized, maskless electrodeposition of lead–tin solder from a sulfonate electrolyte has been achieved by means of laser enhancement. Well defined spots and lines with good surface morphology have been deposited on copper and nickel substrates. This is possible because the laser is found to reduce the deposition overpotential on these substrates.

Original languageEnglish
Pages (from-to)L62-L63
JournalJournal of the Electrochemical Society
Volume139
Issue number6
DOIs
StatePublished - Jun 1992

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