Abstract
Localized, maskless electrodeposition of lead–tin solder from a sulfonate electrolyte has been achieved by means of laser enhancement. Well defined spots and lines with good surface morphology have been deposited on copper and nickel substrates. This is possible because the laser is found to reduce the deposition overpotential on these substrates.
| Original language | English |
|---|---|
| Pages (from-to) | L62-L63 |
| Journal | Journal of the Electrochemical Society |
| Volume | 139 |
| Issue number | 6 |
| DOIs | |
| State | Published - Jun 1992 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 7 Affordable and Clean Energy
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