TY - GEN
T1 - Loading direction versus crack propagation path in a lead-free single solder joint sample
AU - Gao, Feng
AU - Jing, Jianping
AU - Johnson, Janine
AU - Liang, Frank Z.
AU - Williams, Richard L.
AU - Qu, Jianmin
PY - 2009
Y1 - 2009
N2 - In this paper, single solder joints (SSJs) were subjected to moderate speed loading (5mm/sec) in different directions, from pure tensile, mixed mode to pure shear. Fracture surfaces from different loading directions were examined both experimentally and numerically. It is observed that intermetallic compound (IMC) is formed between the solder alloy and the Cu pad, and failure typically occurs at or near the solder/lMC/Cu interfaces on the board side. Pure tensile loading typically leads to interfacial fracture along the IMC/Cu interface. Mixed mode loading usually results in a mixture of interfacial and cohesive failure with crack propagating in a zigzag fashion between the solder/IMC interface and the solder alloy. Loading with higher shear component tends to result in more cohesive failure of the solder alloy near the solder/IMC interface. Under pure shear loading, failure is almost always cohesive within the solder alloy near the solder/IMC interface.
AB - In this paper, single solder joints (SSJs) were subjected to moderate speed loading (5mm/sec) in different directions, from pure tensile, mixed mode to pure shear. Fracture surfaces from different loading directions were examined both experimentally and numerically. It is observed that intermetallic compound (IMC) is formed between the solder alloy and the Cu pad, and failure typically occurs at or near the solder/lMC/Cu interfaces on the board side. Pure tensile loading typically leads to interfacial fracture along the IMC/Cu interface. Mixed mode loading usually results in a mixture of interfacial and cohesive failure with crack propagating in a zigzag fashion between the solder/IMC interface and the solder alloy. Loading with higher shear component tends to result in more cohesive failure of the solder alloy near the solder/IMC interface. Under pure shear loading, failure is almost always cohesive within the solder alloy near the solder/IMC interface.
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U2 - 10.1115/IMECE2008-68099
DO - 10.1115/IMECE2008-68099
M3 - Conference contribution
AN - SCOPUS:70149120935
SN - 9780791848678
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings
SP - 145
EP - 152
BT - Electronics and Photonics
T2 - 2008 ASME International Mechanical Engineering Congress and Exposition, IMECE 2008
Y2 - 31 October 2008 through 6 November 2008
ER -