Low-cost large area processing using small area substrates - A novel multitiled palletization concept for MCM-D thin film process

Swapan K. Bhattacharya, Brian M. Gardner, Jianmin Qu, Daniel F. Baldwin, Rao R. Tummala

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Multichip module-deposited (MCM-D) has been the solution for integrated high density packaging due to its superior line resolution and higher inputs/outputs (I/O) density compared to MCM-C and multichip module-laminate (MCM-L) technologies. However, the consumer demand for high performance products at reduced costs is ever increasing, and this trend is expected to continue in the 21st Century. In order to find a low-cost solution for future MCM-D packaging, a novel palletization process which incorporates several tiles (alumina or silicon) on a large carrier glass (pallet) has been established in this study. The multitiling format provides simultaneous processing of several small tiles onto a re-usable CTE matched carrier glass. The tiles are attached to the glass with a low modulus adhesive that can be released at an elevated temperature (∼ 450° C). The objective of this study is to develop a multitiling process for a 300 mm × 300 mm area that is scalable up to 600 mm × 600 mm format. There are several challenges in realization of the large area palletization approach, such as formulation and qualification of a high temperature reworkable adhesive and minimization of out-of-plane warpage of the tiled assembly. Finite element models for warpage and its validation by Shadow Moire measurement, formulation of a compliant adhesive for thermal stability up to 400 °C are reported in previous publications. This paper deals with 1) the validation of the palletization concept on a 300 mm × 300 mm glass with weight restriction below 3 lbs and thickness limitation to <6.25 mm, and 2) qualification of the formulated adhesive through a correlative study on high temperature detachability of the attached tiles, chemical compatibility of the adhesive with acids, bases, and less polar solvents, and interfacial shear strength at the lass/adhesive/tile joints. MCM-D thin film process on the tiled substrates is to be conducted by the member companies of the MCM-D Consortium.

Original languageEnglish
Pages (from-to)661-671
Number of pages11
JournalIEEE Transactions on Advanced Packaging
Volume23
Issue number4
DOIs
StatePublished - 2000

Keywords

  • Borofloat
  • Clearfloat
  • DCB
  • MCM-D
  • Packaging
  • Pallet
  • Palletization
  • Silicon
  • Tile

Fingerprint

Dive into the research topics of 'Low-cost large area processing using small area substrates - A novel multitiled palletization concept for MCM-D thin film process'. Together they form a unique fingerprint.

Cite this