TY - GEN
T1 - Markov random fields in pattern recognition for semiconductor manufacturing
AU - Baron, Michael
AU - Lakshminarayan, Choudur K.
AU - Chen, Zhenwu
PY - 2001/2
Y1 - 2001/2
N2 - Under the most general conditions of an anisotropic Markov random field, we model the two-dimensional spatial distribution of microchips on a silicon wafer. The proposed model improves on its predecessors as it stipulates the spatial correlation of different strengths in all eight directions. Its canonical parameters represent the intensity of failures, main effects, and interactions of neighboring chips. Explicit forms of conditional distributions are derived, and maximum pseudo-likelihood estimates of canonical parameters are obtained. This numerical characteristic summarizes general patterns of clusters of failing chips on a wafer, capturing their size, shape, direction, density, and thickness. It is used to classify incoming wafers to known root-cause categories by matching them to the closest pattern.
AB - Under the most general conditions of an anisotropic Markov random field, we model the two-dimensional spatial distribution of microchips on a silicon wafer. The proposed model improves on its predecessors as it stipulates the spatial correlation of different strengths in all eight directions. Its canonical parameters represent the intensity of failures, main effects, and interactions of neighboring chips. Explicit forms of conditional distributions are derived, and maximum pseudo-likelihood estimates of canonical parameters are obtained. This numerical characteristic summarizes general patterns of clusters of failing chips on a wafer, capturing their size, shape, direction, density, and thickness. It is used to classify incoming wafers to known root-cause categories by matching them to the closest pattern.
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U2 - 10.1198/00401700152404336
DO - 10.1198/00401700152404336
M3 - Article
AN - SCOPUS:0035253262
SN - 0040-1706
VL - 43
SP - 66
EP - 72
JO - Technometrics
JF - Technometrics
ER -