TY - GEN
T1 - Micro undulated contact surfaces on the contact behavior of a MEMS switch
AU - Shi, Yong
AU - Kim, Sang Gook
PY - 2005
Y1 - 2005
N2 - A novel direct contact micro-device has been developed with periodically micro-grooved lateral metal contacts on the sidewall of the MEMS relay. The uniqueness of the design lies in the self-cleaning mechanism of the microgrooved lateral metal contacts. The concept-proving device is fabricated by integrating a high aspect ratio polymer beam structure with lateral metal contacts. The long lifecycle test shows that the contact resistance has been maintained below 0.1 ohm over 10 billion cycles. The switch design is compatible to the surface micromachining processes and can be readily integrated into a fully functional MEMS relay. Our design opens the possibility of direct contact MEMS switch for both high power and low cost wireless applications.
AB - A novel direct contact micro-device has been developed with periodically micro-grooved lateral metal contacts on the sidewall of the MEMS relay. The uniqueness of the design lies in the self-cleaning mechanism of the microgrooved lateral metal contacts. The concept-proving device is fabricated by integrating a high aspect ratio polymer beam structure with lateral metal contacts. The long lifecycle test shows that the contact resistance has been maintained below 0.1 ohm over 10 billion cycles. The switch design is compatible to the surface micromachining processes and can be readily integrated into a fully functional MEMS relay. Our design opens the possibility of direct contact MEMS switch for both high power and low cost wireless applications.
UR - http://www.scopus.com/inward/record.url?scp=33144476708&partnerID=8YFLogxK
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U2 - 10.1115/wtc2005-63743
DO - 10.1115/wtc2005-63743
M3 - Conference contribution
AN - SCOPUS:33144476708
SN - 0791842029
SN - 9780791842027
T3 - Proceedings of the World Tribology Congress III - 2005
SP - 797
EP - 798
BT - Proceedings of the World Tribology Congress III - 2005
T2 - 2005 World Tribology Congress III
Y2 - 12 September 2005 through 16 September 2005
ER -