Abstract
The trends of microelectronic devices have advanced to the stage that they operate in excess of 200 MHz with submicron feature size. Furthermore, these high performance IC requires Inputs/Outputs (I/O) signals that are in excess of a few 1000's. Low-cost, high performance flip-chip, area array solder joint interconnects are key to the success of this technology. In order to enhance the thermal-cycle fatigue-life of these solder joints, underfill encapsulants are needed. In this talk, we will review the microelectronic packaging technology trends, the role of reliability, in particularly, the use of underfill encapsulants to enhance the thermal cycle fatigue life of solder joints will be discussed.
Original language | English |
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Pages | 3-8 |
Number of pages | 6 |
State | Published - 1997 |
Event | Proceedings of the 1997 TMS Annual Meeting - Orlando, FL, USA Duration: 10 Feb 1997 → 13 Feb 1997 |
Conference
Conference | Proceedings of the 1997 TMS Annual Meeting |
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City | Orlando, FL, USA |
Period | 10/02/97 → 13/02/97 |