Microelectronic package trends - the role of reliability in particularly, related to solder joints reliability

C. P. Wong, Rao Tummala, J. Qu, S. Sitaraman

Research output: Contribution to conferencePaperpeer-review

2 Scopus citations

Abstract

The trends of microelectronic devices have advanced to the stage that they operate in excess of 200 MHz with submicron feature size. Furthermore, these high performance IC requires Inputs/Outputs (I/O) signals that are in excess of a few 1000's. Low-cost, high performance flip-chip, area array solder joint interconnects are key to the success of this technology. In order to enhance the thermal-cycle fatigue-life of these solder joints, underfill encapsulants are needed. In this talk, we will review the microelectronic packaging technology trends, the role of reliability, in particularly, the use of underfill encapsulants to enhance the thermal cycle fatigue life of solder joints will be discussed.

Original languageEnglish
Pages3-8
Number of pages6
StatePublished - 1997
EventProceedings of the 1997 TMS Annual Meeting - Orlando, FL, USA
Duration: 10 Feb 199713 Feb 1997

Conference

ConferenceProceedings of the 1997 TMS Annual Meeting
CityOrlando, FL, USA
Period10/02/9713/02/97

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