TY - GEN
T1 - Microgrooves enhanced AC electrothermal pumping for high conductivity microfluids
AU - Du, E.
AU - Manoochehri, Souran
PY - 2008
Y1 - 2008
N2 - This paper presents utilization of microgrooved structure in enhancing manipulation of high conductivity fluids with alternating current (AC) electrothermal mechanism with low electric voltage requirement (<10 V ). Two manipulation modes including bidirectional pumping and stationary state can be achieved by changing the electric frequency. Numerical simulations are performed and the effects on electrothermal driven fluid motion in grooved surface structure are investigated. The pumping capacity of several grooved profiles of rectangular, trapezoid and hybrid trapezoid are analyzed and compared. The theoretical analysis as well as the numerical simulation indicates that electrothermal driven micropumping and temperature rise can be controlled in these structures for optimum operations.
AB - This paper presents utilization of microgrooved structure in enhancing manipulation of high conductivity fluids with alternating current (AC) electrothermal mechanism with low electric voltage requirement (<10 V ). Two manipulation modes including bidirectional pumping and stationary state can be achieved by changing the electric frequency. Numerical simulations are performed and the effects on electrothermal driven fluid motion in grooved surface structure are investigated. The pumping capacity of several grooved profiles of rectangular, trapezoid and hybrid trapezoid are analyzed and compared. The theoretical analysis as well as the numerical simulation indicates that electrothermal driven micropumping and temperature rise can be controlled in these structures for optimum operations.
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U2 - 10.1115/DETC2008-49492
DO - 10.1115/DETC2008-49492
M3 - Conference contribution
AN - SCOPUS:81155132257
SN - 9780791843284
T3 - Proceedings of the ASME Design Engineering Technical Conference
SP - 831
EP - 837
BT - ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2008
T2 - ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2008
Y2 - 3 August 2008 through 6 August 2008
ER -