TY - JOUR
T1 - Modeling of wet stiction in microelectromechanical systems (MEMS)
AU - Hariri, Alireza
AU - Zu, Jean
AU - Mrad, Ridha Ben
PY - 2007/10
Y1 - 2007/10
N2 - Stiction, which is a term commonly used in microelectromechanical systems (MEMS) to refer to adhesion, is a major failure mode in MEMS. Undesirable stiction, which results from the contact between surfaces, can severely compromise the reliability of MEMS. In this paper, a model is developed for predicting stiction between uncharged micro parts interacting in a humid environment. In this condition, for hydrophilic surfaces, the capillary and asperity deformation forces are dominant. Here, using a newly developed multiple asperity contact model, a model is developed for the capillary force between rough micro surfaces, and the new model is combined with a newly developed elastic/plastic deformation model for rough surfaces to solve for the equilibrium of the forces. This in turn yields the equilibrium distance between micro surfaces using which the apparent work of adhesion can be found. The theoretical results are compared with the available experimental data from literature. The developed model can be easily used for design purposes. If the topographic data and material constants are known, the desirable adhesion parameters can be quickly found from the model.
AB - Stiction, which is a term commonly used in microelectromechanical systems (MEMS) to refer to adhesion, is a major failure mode in MEMS. Undesirable stiction, which results from the contact between surfaces, can severely compromise the reliability of MEMS. In this paper, a model is developed for predicting stiction between uncharged micro parts interacting in a humid environment. In this condition, for hydrophilic surfaces, the capillary and asperity deformation forces are dominant. Here, using a newly developed multiple asperity contact model, a model is developed for the capillary force between rough micro surfaces, and the new model is combined with a newly developed elastic/plastic deformation model for rough surfaces to solve for the equilibrium of the forces. This in turn yields the equilibrium distance between micro surfaces using which the apparent work of adhesion can be found. The theoretical results are compared with the available experimental data from literature. The developed model can be easily used for design purposes. If the topographic data and material constants are known, the desirable adhesion parameters can be quickly found from the model.
KW - Failure analysis
KW - Mechanical systems
UR - http://www.scopus.com/inward/record.url?scp=34948890541&partnerID=8YFLogxK
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U2 - 10.1109/JMEMS.2007.904349
DO - 10.1109/JMEMS.2007.904349
M3 - Article
AN - SCOPUS:34948890541
SN - 1057-7157
VL - 16
SP - 1276
EP - 1285
JO - Journal of Microelectromechanical Systems
JF - Journal of Microelectromechanical Systems
IS - 5
ER -