TY - GEN
T1 - Molecular dynamics modeling of thermal transport in damaged continua
AU - Kumar, Navin
AU - Pochiraju, Kishore
PY - 2008
Y1 - 2008
N2 - The interaction between the damage state and the thermal conductivity is studied in this paper. The damage propagation and the effective thermal conductivity of the damaged continuum is studied using equilibrium molecular dynamics (EMD) method based on the Green-Kubo relation. A solid gold lattice is considered and the damage is initiated and propagated by stretching two opposite ends while system is maintained at constant volume, constant temperature (NVT) condition. Both Lennard-Jones (LJ) 6-12 and embedded-atom method (EAM) potentials are used to model the inter-atomic interactions. Results are presented illustrating the load-displacement relationship during damage growth and the thermal conductivity change behavior for a selected crack length.
AB - The interaction between the damage state and the thermal conductivity is studied in this paper. The damage propagation and the effective thermal conductivity of the damaged continuum is studied using equilibrium molecular dynamics (EMD) method based on the Green-Kubo relation. A solid gold lattice is considered and the damage is initiated and propagated by stretching two opposite ends while system is maintained at constant volume, constant temperature (NVT) condition. Both Lennard-Jones (LJ) 6-12 and embedded-atom method (EAM) potentials are used to model the inter-atomic interactions. Results are presented illustrating the load-displacement relationship during damage growth and the thermal conductivity change behavior for a selected crack length.
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U2 - 10.1115/MicroNano2008-70070
DO - 10.1115/MicroNano2008-70070
M3 - Conference contribution
AN - SCOPUS:69949178823
SN - 0791842940
SN - 9780791842942
T3 - 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
SP - 295
EP - 300
BT - 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
T2 - 2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
Y2 - 3 June 2008 through 5 June 2008
ER -