TY - GEN
T1 - Monolithic Fabrication of Micron-Scale Piezo-Polymer Transducers on CMOS
AU - Arslan, Volkan
AU - Jadwiszczak, Jakub
AU - Sherman, Jeffrey
AU - Uguz, Ilke
AU - Shepard, Kenneth L.
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - There is growing interest in integrating piezoelectric materials with CMOS technology to enable a wide range of bioelectronic applications-including data telemetry, medical ultrasound imaging and energy harvesting. However, current integration methods face challenges in continued technology scaling and miniturazation. In this work, we present a scalable approach to integrating miniaturized arrays of ultrasound transducers - based on polymer piezoelectrics - directly onto individual CMOS die as part of an advanced fabrication and packaging flow. The on-CMOS piezoelectric transducers fabricated in this manner are more than two orders of magnitude smaller than the current state-of-the-art. We demonstrate our miniaturized transducer array in the context of both in-vitro and in-vivo photoacoustic imaging.
AB - There is growing interest in integrating piezoelectric materials with CMOS technology to enable a wide range of bioelectronic applications-including data telemetry, medical ultrasound imaging and energy harvesting. However, current integration methods face challenges in continued technology scaling and miniturazation. In this work, we present a scalable approach to integrating miniaturized arrays of ultrasound transducers - based on polymer piezoelectrics - directly onto individual CMOS die as part of an advanced fabrication and packaging flow. The on-CMOS piezoelectric transducers fabricated in this manner are more than two orders of magnitude smaller than the current state-of-the-art. We demonstrate our miniaturized transducer array in the context of both in-vitro and in-vivo photoacoustic imaging.
UR - https://www.scopus.com/pages/publications/86000023197
UR - https://www.scopus.com/inward/citedby.url?scp=86000023197&partnerID=8YFLogxK
U2 - 10.1109/IEDM50854.2024.10873315
DO - 10.1109/IEDM50854.2024.10873315
M3 - Conference contribution
AN - SCOPUS:86000023197
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2024 IEEE International Electron Devices Meeting, IEDM 2024
T2 - 2024 IEEE International Electron Devices Meeting, IEDM 2024
Y2 - 7 December 2024 through 11 December 2024
ER -