Multidisciplinary electronic package design and optimization methodology based on genetic algorithm

Tohru Suwa, Hamid Hadim

Research output: Contribution to journalArticlepeer-review

15 Scopus citations

Abstract

A new multidisciplinary design and optimization methodology in electronics packaging is presented. A genetic algorithm combined with multidisciplinary design and multiphysics analysis tools are used to optimize key design parameters. This methodology is developed to improve the electronic package design process by performing multidisciplinary design and optimization at an early design stage. To demonstrate its capability, the methodology is applied to a ball grid array (BGA) package design. Multidisciplinary criteria including thermal, thermal strain, electrical, electromagnetic leakage, and cost are optimized simultaneously. A simplified routability analysis criterion is used as a constraint. The genetic algorithm is used for systematic design optimization. The present methodology can be applied to electronics product design at various packaging levels.

Original languageEnglish
Pages (from-to)402-410
Number of pages9
JournalIEEE Transactions on Advanced Packaging
Volume30
Issue number3
DOIs
StatePublished - Aug 2007

Keywords

  • Ball grid array (BGA) design
  • Electronic packaging design
  • Genetic algorithms
  • Optimization methods

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