TY - JOUR
T1 - Multidisciplinary electronic package design and optimization methodology based on genetic algorithm
AU - Suwa, Tohru
AU - Hadim, Hamid
PY - 2007/8
Y1 - 2007/8
N2 - A new multidisciplinary design and optimization methodology in electronics packaging is presented. A genetic algorithm combined with multidisciplinary design and multiphysics analysis tools are used to optimize key design parameters. This methodology is developed to improve the electronic package design process by performing multidisciplinary design and optimization at an early design stage. To demonstrate its capability, the methodology is applied to a ball grid array (BGA) package design. Multidisciplinary criteria including thermal, thermal strain, electrical, electromagnetic leakage, and cost are optimized simultaneously. A simplified routability analysis criterion is used as a constraint. The genetic algorithm is used for systematic design optimization. The present methodology can be applied to electronics product design at various packaging levels.
AB - A new multidisciplinary design and optimization methodology in electronics packaging is presented. A genetic algorithm combined with multidisciplinary design and multiphysics analysis tools are used to optimize key design parameters. This methodology is developed to improve the electronic package design process by performing multidisciplinary design and optimization at an early design stage. To demonstrate its capability, the methodology is applied to a ball grid array (BGA) package design. Multidisciplinary criteria including thermal, thermal strain, electrical, electromagnetic leakage, and cost are optimized simultaneously. A simplified routability analysis criterion is used as a constraint. The genetic algorithm is used for systematic design optimization. The present methodology can be applied to electronics product design at various packaging levels.
KW - Ball grid array (BGA) design
KW - Electronic packaging design
KW - Genetic algorithms
KW - Optimization methods
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U2 - 10.1109/TADVP.2007.898506
DO - 10.1109/TADVP.2007.898506
M3 - Article
AN - SCOPUS:34548147487
SN - 1521-3323
VL - 30
SP - 402
EP - 410
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
IS - 3
ER -