TY - GEN
T1 - Near field radiative emissivity enhancement with application in electronics cooling
AU - Kaya, Mine
AU - Hajimirza, Shima
AU - Merrikh, Aliakbar
AU - Saeidi, Mehdi
N1 - Publisher Copyright:
© 2019 IEEE
PY - 2019/5
Y1 - 2019/5
N2 - We demonstrate that subwavelength surface textures can enhance the thermal emissivity of a structure. In this study, four different texture patterns are used, including 2D rectangular and triangular strips, 3D square and triangle chips, with different materials used as substrate. Texture material is selected as titanium dioxide due to its high refractive index. The effect of the geometry on the emissivity is parametrically studied, and global optimization is used to maximized infrared emissivity by altering the of 2D rectangular and triangular strips. The results show that a rigorous design procedure can yield a significant improvement in the emissivity of structures.
AB - We demonstrate that subwavelength surface textures can enhance the thermal emissivity of a structure. In this study, four different texture patterns are used, including 2D rectangular and triangular strips, 3D square and triangle chips, with different materials used as substrate. Texture material is selected as titanium dioxide due to its high refractive index. The effect of the geometry on the emissivity is parametrically studied, and global optimization is used to maximized infrared emissivity by altering the of 2D rectangular and triangular strips. The results show that a rigorous design procedure can yield a significant improvement in the emissivity of structures.
KW - Optimization
KW - Passive cooling
KW - Photonics
UR - http://www.scopus.com/inward/record.url?scp=85073910714&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85073910714&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2019.8757320
DO - 10.1109/ITHERM.2019.8757320
M3 - Conference contribution
AN - SCOPUS:85073910714
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
SP - 209
EP - 218
BT - Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
T2 - 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
Y2 - 28 May 2019 through 31 May 2019
ER -