Abstract
Simplified numerical models were developed and experiments were conducted to analyze heat transfer in a printed circuit board which was exposed to natural convection inside an enclosure. The SINDA thermal network analyzer was used for numerical modeling and heat transfer calculations. Simplified experiments were conducted to measure the temperature distribution in the circuit board in order to validate the thermal network models. The effective thermal conductivity of the circuit board was calculated. The convection heat transfer coefficient was determined through an iterative algorithm in which measurements of temperature were compared with results from SINDA until good agreement was reached.
Original language | English |
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Journal | American Society of Mechanical Engineers (Paper) |
State | Published - 1990 |
Event | Proceedings of the Winter Annual Meeting - Dallas, TX, USA Duration: 25 Nov 1990 → 30 Nov 1990 |