Numerical and experimental heat transfer analysis of a printed circuit board

A. Hadim, A. T. Chang, T. Diedwardo

Research output: Contribution to journalConference articlepeer-review

Abstract

Simplified numerical models were developed and experiments were conducted to analyze heat transfer in a printed circuit board which was exposed to natural convection inside an enclosure. The SINDA thermal network analyzer was used for numerical modeling and heat transfer calculations. Simplified experiments were conducted to measure the temperature distribution in the circuit board in order to validate the thermal network models. The effective thermal conductivity of the circuit board was calculated. The convection heat transfer coefficient was determined through an iterative algorithm in which measurements of temperature were compared with results from SINDA until good agreement was reached.

Original languageEnglish
JournalAmerican Society of Mechanical Engineers (Paper)
StatePublished - 1990
EventProceedings of the Winter Annual Meeting - Dallas, TX, USA
Duration: 25 Nov 199030 Nov 1990

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