Numerical and experimental investigations of large ic flip chip attach

A. Schubert, R. Dudek, R. Leutenbauer, P. Coskina, K. F. Becker, J. Kloeser, B. Michel, H. Reichl, D. Baldwin, J. Qu, S. Sitaraman, C. P. Wong, R. Tummala

Research output: Contribution to journalArticlepeer-review

11 Scopus citations

Abstract

A study was conducted to investigate the reliability of large FCOB assemblies through both thermal cycling tests and numerical simulation. Samples with IC sizes from 10 mm to 40 mm were prepared and subjected to thermal cycling (AATC -55°C/+125°C0 to verify the simulation results with the experimental findings.

Original languageEnglish
Pages (from-to)1338-1346
Number of pages9
JournalProceedings - Electronic Components and Technology Conference
StatePublished - 2000

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