Abstract
A study was conducted to investigate the reliability of large FCOB assemblies through both thermal cycling tests and numerical simulation. Samples with IC sizes from 10 mm to 40 mm were prepared and subjected to thermal cycling (AATC -55°C/+125°C0 to verify the simulation results with the experimental findings.
Original language | English |
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Pages (from-to) | 1338-1346 |
Number of pages | 9 |
Journal | Proceedings - Electronic Components and Technology Conference |
State | Published - 2000 |