Numerical and experimental investigations of large ic flip chip attach

A. Schubert; R. Dudek; R. Leutenbauer; P. Coskina; K. F. Becker; J. Kloeser; B. Michel; H. Reichl; D. Baldwin; J. Qu; S. Sitaraman; C. P. Wong; R. Tummala

Numerical and experimental investigations of large ic flip chip attach

A. Schubert
, R. Dudek
, R. Leutenbauer
, P. Coskina
, K. F. Becker
, J. Kloeser
, B. Michel
, H. Reichl
, D. Baldwin
, J. Qu
, S. Sitaraman
, C. P. Wong
, R. Tummala

Research output: Contribution to journal › Article › peer-review

11 Scopus citations

Abstract

A study was conducted to investigate the reliability of large FCOB assemblies through both thermal cycling tests and numerical simulation. Samples with IC sizes from 10 mm to 40 mm were prepared and subjected to thermal cycling (AATC -55°C/+125°C0 to verify the simulation results with the experimental findings.

Original language	English
Pages (from-to)	1338-1346
Number of pages	9
Journal	Proceedings - Electronic Components and Technology Conference
State	Published - 2000

Cite this

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title = "Numerical and experimental investigations of large ic flip chip attach",

abstract = "A study was conducted to investigate the reliability of large FCOB assemblies through both thermal cycling tests and numerical simulation. Samples with IC sizes from 10 mm to 40 mm were prepared and subjected to thermal cycling (AATC -55°C/+125°C0 to verify the simulation results with the experimental findings.",

author = "A. Schubert and R. Dudek and R. Leutenbauer and P. Coskina and Becker, \{K. F.\} and J. Kloeser and B. Michel and H. Reichl and D. Baldwin and J. Qu and S. Sitaraman and Wong, \{C. P.\} and R. Tummala",

year = "2000",

language = "English",

pages = "1338--1346",

}

TY - JOUR

T1 - Numerical and experimental investigations of large ic flip chip attach

AU - Schubert, A.

AU - Dudek, R.

AU - Leutenbauer, R.

AU - Coskina, P.

AU - Becker, K. F.

AU - Kloeser, J.

AU - Michel, B.

AU - Reichl, H.

AU - Baldwin, D.

AU - Qu, J.

AU - Sitaraman, S.

AU - Wong, C. P.

AU - Tummala, R.

PY - 2000

Y1 - 2000

N2 - A study was conducted to investigate the reliability of large FCOB assemblies through both thermal cycling tests and numerical simulation. Samples with IC sizes from 10 mm to 40 mm were prepared and subjected to thermal cycling (AATC -55°C/+125°C0 to verify the simulation results with the experimental findings.

AB - A study was conducted to investigate the reliability of large FCOB assemblies through both thermal cycling tests and numerical simulation. Samples with IC sizes from 10 mm to 40 mm were prepared and subjected to thermal cycling (AATC -55°C/+125°C0 to verify the simulation results with the experimental findings.

UR - https://www.scopus.com/pages/publications/0034484439

UR - https://www.scopus.com/pages/publications/0034484439#tab=citedBy

M3 - Article

AN - SCOPUS:0034484439

SN - 0569-5503

SP - 1338

EP - 1346

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

ER -

Numerical and experimental investigations of large ic flip chip attach

Abstract

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