Optimal placement of heat generating components at various levels of electronics packaging

Tohru Suwa, Hamid Hadim

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

A multidisciplinary placement optimization methodology for heat generating electronics components is demonstrated at various levels of electronics packaging design. The proposed methodology is capable of handling a large number of conflicting multidisciplinary design requirements and complex trade-offs including thermal, mechanical, electrical, electromagnetic, cost among others, which are optimized simultaneously using a genetic algorithm. An effective thermal performance prediction methodology is developed to shorten the calculation time while retaining sufficient accuracy. For simpler thermal problems, a superposition method is used to predict the temperature distribution caused by arbitrarily placed multiple heat sources. For more complex problems (e.g. variable local heat transfer coefficient) artificial neural networks (ANNs) and the superposition method are combined for more efficient prediction of surface (case) and junction temperatures. The proposed methodology is designed to handle existing complex design trade-offs at the crucial early design stage. Capabilities of the present methodology are demonstrated by applying it to several standard benchmarks at the enclosure (PCB) and chip (logic block) levels.

Original languageEnglish
Title of host publicationProceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009
Pages185-190
Number of pages6
DOIs
StatePublished - 2010
Event2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009 - Lake Buena Vista, FL, United States
Duration: 13 Nov 200919 Nov 2009

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings
Volume5

Conference

Conference2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009
Country/TerritoryUnited States
CityLake Buena Vista, FL
Period13/11/0919/11/09

Keywords

  • Artificial neural network
  • Component placement optimization
  • Electronics packaging

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