Optimal placement of heat generating components at various levels of electronics packaging

Engineering

• Superposition Method 100%
• Optimal Placement 100%
• Electronic Packaging 100%
• Optimization 50%
• Design 50%
• Large Number 50%
• Genetic Algorithm 50%
• Design Requirement 50%
• Thermal Performance 50%
• Junction Temperature 50%
• Benchmark 50%
• Electronics 50%
• Heat Source 50%
• Design Trade 50%
• Design Stage 50%
• Performance Prediction 50%
• Block Level 50%
• Temperature Distribution 50%
• Prediction 50%
• Surface 50%
• Accuracy 50%
• Artificial Neural Network 50%
• Thermal Problem 50%
• Local Heat Transfer Coefficient 50%