TY - GEN
T1 - Overview of Millimeter-Wave Wireless Interconnect
T2 - 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021
AU - Kim, Yanghyo
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/8/25
Y1 - 2021/8/25
N2 - This paper presents the overview of solid-state-based millimeter-wave wireless interconnects. Conventional mechanical connectors face issues from long-term reliability, signal-integrity, environmental hazard, and large form-factor. To remove the physical connection, direct baseband couplings via capacitors, inductors, and transmission lines, and carrier-modulation couplings via antennas have been explored for the past 40 years. The focus of this work is millimeter-wave wireless interconnects implemented in advanced CMOS technologies. Carrier frequencies ranging from 60 GHz to 150 GHz, and modulation schemes including on-off-keying and multi-level pulse amplitude modulation are demonstrated to achieve data rates of 6 Gb/s to 30 Gb/s with the energy efficiency less than 10 pJ/b.
AB - This paper presents the overview of solid-state-based millimeter-wave wireless interconnects. Conventional mechanical connectors face issues from long-term reliability, signal-integrity, environmental hazard, and large form-factor. To remove the physical connection, direct baseband couplings via capacitors, inductors, and transmission lines, and carrier-modulation couplings via antennas have been explored for the past 40 years. The focus of this work is millimeter-wave wireless interconnects implemented in advanced CMOS technologies. Carrier frequencies ranging from 60 GHz to 150 GHz, and modulation schemes including on-off-keying and multi-level pulse amplitude modulation are demonstrated to achieve data rates of 6 Gb/s to 30 Gb/s with the energy efficiency less than 10 pJ/b.
KW - Contactless Connector
KW - Digital Pre-Distortion
KW - MOS
KW - Millimeter-Wave Wireless Interconnect
KW - Pulse Amplitude Modulation
UR - http://www.scopus.com/inward/record.url?scp=85118156912&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85118156912&partnerID=8YFLogxK
U2 - 10.1109/RFIT52905.2021.9565278
DO - 10.1109/RFIT52905.2021.9565278
M3 - Conference contribution
AN - SCOPUS:85118156912
T3 - 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021
BT - 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021
Y2 - 25 August 2021 through 27 August 2021
ER -