Overview of Millimeter-Wave Wireless Interconnect: (Invited)

Yanghyo Kim

doi:10.1109/RFIT52905.2021.9565278

Overview of Millimeter-Wave Wireless Interconnect: (Invited)

Yanghyo Kim

Department of Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

This paper presents the overview of solid-state-based millimeter-wave wireless interconnects. Conventional mechanical connectors face issues from long-term reliability, signal-integrity, environmental hazard, and large form-factor. To remove the physical connection, direct baseband couplings via capacitors, inductors, and transmission lines, and carrier-modulation couplings via antennas have been explored for the past 40 years. The focus of this work is millimeter-wave wireless interconnects implemented in advanced CMOS technologies. Carrier frequencies ranging from 60 GHz to 150 GHz, and modulation schemes including on-off-keying and multi-level pulse amplitude modulation are demonstrated to achieve data rates of 6 Gb/s to 30 Gb/s with the energy efficiency less than 10 pJ/b.

Original language	English
Title of host publication	2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021
ISBN (Electronic)	9781665433914
DOIs	https://doi.org/10.1109/RFIT52905.2021.9565278
State	Published - 25 Aug 2021
Event	2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021 - Hualien, Taiwan, Province of China Duration: 25 Aug 2021 → 27 Aug 2021

Publication series

Name	2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021

Conference

Conference	2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021
Country/Territory	Taiwan, Province of China
City	Hualien
Period	25/08/21 → 27/08/21

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

Keywords

Contactless Connector
Digital Pre-Distortion
MOS
Millimeter-Wave Wireless Interconnect
Pulse Amplitude Modulation

Access to Document

10.1109/RFIT52905.2021.9565278

Cite this

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title = "Overview of Millimeter-Wave Wireless Interconnect: (Invited)",

abstract = "This paper presents the overview of solid-state-based millimeter-wave wireless interconnects. Conventional mechanical connectors face issues from long-term reliability, signal-integrity, environmental hazard, and large form-factor. To remove the physical connection, direct baseband couplings via capacitors, inductors, and transmission lines, and carrier-modulation couplings via antennas have been explored for the past 40 years. The focus of this work is millimeter-wave wireless interconnects implemented in advanced CMOS technologies. Carrier frequencies ranging from 60 GHz to 150 GHz, and modulation schemes including on-off-keying and multi-level pulse amplitude modulation are demonstrated to achieve data rates of 6 Gb/s to 30 Gb/s with the energy efficiency less than 10 pJ/b.",

keywords = "Contactless Connector, Digital Pre-Distortion, MOS, Millimeter-Wave Wireless Interconnect, Pulse Amplitude Modulation",

author = "Yanghyo Kim",

note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021 ; Conference date: 25-08-2021 Through 27-08-2021",

year = "2021",

month = aug,

day = "25",

doi = "10.1109/RFIT52905.2021.9565278",

language = "English",

series = "2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021",

booktitle = "2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021",

}

Kim, Y 2021, Overview of Millimeter-Wave Wireless Interconnect: (Invited). in 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021. 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021, 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021, Hualien, Taiwan, Province of China, 25/08/21. https://doi.org/10.1109/RFIT52905.2021.9565278

TY - GEN

T1 - Overview of Millimeter-Wave Wireless Interconnect

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AU - Kim, Yanghyo

PY - 2021/8/25

Y1 - 2021/8/25

N2 - This paper presents the overview of solid-state-based millimeter-wave wireless interconnects. Conventional mechanical connectors face issues from long-term reliability, signal-integrity, environmental hazard, and large form-factor. To remove the physical connection, direct baseband couplings via capacitors, inductors, and transmission lines, and carrier-modulation couplings via antennas have been explored for the past 40 years. The focus of this work is millimeter-wave wireless interconnects implemented in advanced CMOS technologies. Carrier frequencies ranging from 60 GHz to 150 GHz, and modulation schemes including on-off-keying and multi-level pulse amplitude modulation are demonstrated to achieve data rates of 6 Gb/s to 30 Gb/s with the energy efficiency less than 10 pJ/b.

AB - This paper presents the overview of solid-state-based millimeter-wave wireless interconnects. Conventional mechanical connectors face issues from long-term reliability, signal-integrity, environmental hazard, and large form-factor. To remove the physical connection, direct baseband couplings via capacitors, inductors, and transmission lines, and carrier-modulation couplings via antennas have been explored for the past 40 years. The focus of this work is millimeter-wave wireless interconnects implemented in advanced CMOS technologies. Carrier frequencies ranging from 60 GHz to 150 GHz, and modulation schemes including on-off-keying and multi-level pulse amplitude modulation are demonstrated to achieve data rates of 6 Gb/s to 30 Gb/s with the energy efficiency less than 10 pJ/b.

KW - Contactless Connector

KW - Digital Pre-Distortion

KW - MOS

KW - Millimeter-Wave Wireless Interconnect

KW - Pulse Amplitude Modulation

UR - https://www.scopus.com/pages/publications/85118156912

UR - https://www.scopus.com/pages/publications/85118156912#tab=citedBy

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DO - 10.1109/RFIT52905.2021.9565278

M3 - Conference contribution

AN - SCOPUS:85118156912

T3 - 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021

BT - 2021 IEEE International Symposium on Radio-Frequency Integration Technology, RFIT 2021

Y2 - 25 August 2021 through 27 August 2021

ER -

Overview of Millimeter-Wave Wireless Interconnect: (Invited)

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

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