TY - GEN
T1 - Piezoelectrically actuated microvalves for micropropulsion applications
AU - Yang, Eui Hyeok
AU - Lee, Choonsup
PY - 2002
Y1 - 2002
N2 - This paper presents a piezoelectric microvalve technology with a high pressure handling capability for micropropulsion applications. The device is a normally closed valve fabricated mostly by the micromachining of silicon. The valve consists of a custom designed piezoelectric stack actuator bonded onto silicon valve components in a stainless steel housing. Major elements of the silicon valve design include narrow edge seating rings and tensile-stressed silicon tethers that contribute to the desired normally closed leak-tight operation. No leak has been detected from a soap solution test at differential pressures of 0∼500 psi for a normally closed valve structure, indicating a leak rate of 0.001sccm or lower has been achieved. Piezoelectric operation has been successfully demonstrated at a differential pressure of 500 psi. A flow rate of 20 sccm at 100 psi has been obtained at 50 V.
AB - This paper presents a piezoelectric microvalve technology with a high pressure handling capability for micropropulsion applications. The device is a normally closed valve fabricated mostly by the micromachining of silicon. The valve consists of a custom designed piezoelectric stack actuator bonded onto silicon valve components in a stainless steel housing. Major elements of the silicon valve design include narrow edge seating rings and tensile-stressed silicon tethers that contribute to the desired normally closed leak-tight operation. No leak has been detected from a soap solution test at differential pressures of 0∼500 psi for a normally closed valve structure, indicating a leak rate of 0.001sccm or lower has been achieved. Piezoelectric operation has been successfully demonstrated at a differential pressure of 500 psi. A flow rate of 20 sccm at 100 psi has been obtained at 50 V.
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U2 - 10.1115/IMECE2002-33783
DO - 10.1115/IMECE2002-33783
M3 - Conference contribution
AN - SCOPUS:78249282955
SN - 0791836428
SN - 9780791836422
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings
SP - 449
EP - 453
BT - Microelectromechanical Systems
ER -