Abstract
The process-induced thermal stress field in a glob top encapsulated single chip module was studied. The effects of the size of the package, the presence of delamination, and the contact angle of the glob top encapsulant were investigated, and the effects of these parameters on the interfacial stresses were determined. The energy release rate and stress intensity factors at the crack tip were obtained through finite element method. Results showed that the encapsulant should be dispensed all the way to the edge of the chip to minimize the driving force for initiating delamination cracks. An interface with a higher resistance to mode I fracture is also desirable to prevent interface delamination.
Original language | English |
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Pages | 123-131 |
Number of pages | 9 |
State | Published - 1995 |
Event | Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition - San Francisco, CA, USA Duration: 12 Nov 1995 → 17 Nov 1995 |
Conference
Conference | Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition |
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City | San Francisco, CA, USA |
Period | 12/11/95 → 17/11/95 |