TY - GEN
T1 - PWB deflection vs. vibration-induced solder joint deformation
AU - Hevel, Elliot
AU - Qu, Jianmin
PY - 2012
Y1 - 2012
N2 - Vibration-induced solder joint failure is one of the common failure modes in microelectronics used in the automotive and the aerospace industries. In most of these applications, printed wiring boards (PWBs) with multiple surface-mount components are attached to a base frame through either sockets, clamps, or receptacles. Since the base frame is typically attached to the vehicle, the vehicle's vibration causes the PWB to vibrate. Transverse vibration of the PWB results in significant board deflection. Deflection of the PWB induces significant strain of the solder joints on the surface-mounted components.
AB - Vibration-induced solder joint failure is one of the common failure modes in microelectronics used in the automotive and the aerospace industries. In most of these applications, printed wiring boards (PWBs) with multiple surface-mount components are attached to a base frame through either sockets, clamps, or receptacles. Since the base frame is typically attached to the vehicle, the vehicle's vibration causes the PWB to vibrate. Transverse vibration of the PWB results in significant board deflection. Deflection of the PWB induces significant strain of the solder joints on the surface-mounted components.
UR - http://www.scopus.com/inward/record.url?scp=84866159838&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84866159838&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2012.6231504
DO - 10.1109/ITHERM.2012.6231504
M3 - Conference contribution
AN - SCOPUS:84866159838
SN - 9781424495320
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
SP - 762
EP - 764
BT - Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
T2 - 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Y2 - 30 May 2012 through 1 June 2012
ER -