PWB deflection vs. vibration-induced solder joint deformation

Elliot Hevel, Jianmin Qu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Vibration-induced solder joint failure is one of the common failure modes in microelectronics used in the automotive and the aerospace industries. In most of these applications, printed wiring boards (PWBs) with multiple surface-mount components are attached to a base frame through either sockets, clamps, or receptacles. Since the base frame is typically attached to the vehicle, the vehicle's vibration causes the PWB to vibrate. Transverse vibration of the PWB results in significant board deflection. Deflection of the PWB induces significant strain of the solder joints on the surface-mounted components.

Original languageEnglish
Title of host publicationProceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Pages762-764
Number of pages3
DOIs
StatePublished - 2012
Event13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 - San Diego, CA, United States
Duration: 30 May 20121 Jun 2012

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
ISSN (Print)1936-3958

Conference

Conference13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Country/TerritoryUnited States
CitySan Diego, CA
Period30/05/121/06/12

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