TY - JOUR
T1 - Quantitative characterization of underfill/substrate interfacial toughness enhancement by silane additives
AU - Yao, Qizhou
AU - Qu, Jianmin
AU - Wu, Jiali
AU - Wong, C. P.
PY - 1999
Y1 - 1999
N2 - The apparent fracture toughness of the interfaces between epoxy-based underfill materials and various substrates is experimentally measured. Small amount of silane coupling agents is added to the base underfill to form various underfill derivatives. Double layer specimens with preexisting interfacial cracks are made for four-point bending tests. The substrates tested include aluminum, polyimide, BCB, and printed wiring boards (FR-4) with solder mask. The measurements are qualitatively correlated to each silane additive. Although the purpose of adding silane additives was to enhance the adhesion, it is found that the enhancement of interfacial toughness highly depends on the type of substrate. The results of this study have important implications in flip-chip reliability where interfacial cracking is one of the major failure modes.
AB - The apparent fracture toughness of the interfaces between epoxy-based underfill materials and various substrates is experimentally measured. Small amount of silane coupling agents is added to the base underfill to form various underfill derivatives. Double layer specimens with preexisting interfacial cracks are made for four-point bending tests. The substrates tested include aluminum, polyimide, BCB, and printed wiring boards (FR-4) with solder mask. The measurements are qualitatively correlated to each silane additive. Although the purpose of adding silane additives was to enhance the adhesion, it is found that the enhancement of interfacial toughness highly depends on the type of substrate. The results of this study have important implications in flip-chip reliability where interfacial cracking is one of the major failure modes.
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M3 - Conference article
AN - SCOPUS:0032657117
SN - 0569-5503
SP - 1079
EP - 1082
JO - Proceedings - Electronic Components and Technology Conference
JF - Proceedings - Electronic Components and Technology Conference
T2 - Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC)
Y2 - 1 June 1999 through 4 June 1999
ER -