Rheology and stability of highly filled thermal pastes

C. Feger, M. McGlashan-Powell, I. Nnebe, D. M. Kalyon

Research output: Contribution to conferencePaperpeer-review

Original languageEnglish
StatePublished - 2006
EventIMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006 - Scottsdale, AZ, United States
Duration: 20 Mar 200623 Mar 2006

Conference

ConferenceIMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006
Country/TerritoryUnited States
CityScottsdale, AZ
Period20/03/0623/03/06

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