TY - CONF
T1 - Rheology and stability of highly filled thermal pastes
AU - Feger, C.
AU - McGlashan-Powell, M.
AU - Nnebe, I.
AU - Kalyon, D. M.
PY - 2006
Y1 - 2006
UR - http://www.scopus.com/inward/record.url?scp=84877056095&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84877056095&partnerID=8YFLogxK
M3 - Paper
AN - SCOPUS:84877056095
T2 - IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006
Y2 - 20 March 2006 through 23 March 2006
ER -