Rheology and stability of highly filled thermal pastes

C. Feger; M. McGlashan-Powell; I. Nnebe; D. M. Kalyon

Rheology and stability of highly filled thermal pastes

C. Feger
, M. McGlashan-Powell
, I. Nnebe
, D. M. Kalyon

IBM

Research output: Contribution to conference › Paper › peer-review

Original language	English
State	Published - 2006
Event	IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006 - Scottsdale, AZ, United States Duration: 20 Mar 2006 → 23 Mar 2006

Conference

Conference	IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006
Country/Territory	United States
City	Scottsdale, AZ
Period	20/03/06 → 23/03/06

Cite this

@conference{c9d150a98c1448879db77c810c1fa2cd,

title = "Rheology and stability of highly filled thermal pastes",

author = "C. Feger and M. McGlashan-Powell and I. Nnebe and Kalyon, \{D. M.\}",

year = "2006",

language = "English",

note = "IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006 ; Conference date: 20-03-2006 Through 23-03-2006",

}

Rheology and stability of highly filled thermal pastes. / Feger, C.; McGlashan-Powell, M.; Nnebe, I. et al.
2006. Paper presented at IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006, Scottsdale, AZ, United States.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Rheology and stability of highly filled thermal pastes

AU - Feger, C.

AU - McGlashan-Powell, M.

AU - Nnebe, I.

AU - Kalyon, D. M.

PY - 2006

Y1 - 2006

UR - https://www.scopus.com/pages/publications/84877056095

UR - https://www.scopus.com/pages/publications/84877056095#tab=citedBy

M3 - Paper

AN - SCOPUS:84877056095

T2 - IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Spring Conference on Global Business Council, GBC 2006

Y2 - 20 March 2006 through 23 March 2006

ER -

Rheology and stability of highly filled thermal pastes

Conference

Other files and links

Cite this