Signature analysis based IC diagnostics - a statistician's perspective

Choudur K. Lakshminarayan, Seshu Pabbisetty, Chien Pai Han

Research output: Contribution to conferencePaperpeer-review

Abstract

This paper deals with the basic concepts of signature analysis, and will attempt to demonstrate how its implementation would enable efficient utilization of failure analysis engineering resources to analyze field failures and avoid repetitive analyses. This would accomplish the dual objective of improved customer satisfaction and reduced cycle time. Signature analysis methodology can be used in Failure Analysis, Design, Product, and Customer Quality and Reliability engineering group applications. Starting with definitions, purpose, and various possible scenarios, a formal mathematical framework is developed for computing sample sizes and establishing confidence levels when the failures occur at random or occur in clusters.

Original languageEnglish
Pages167-171
Number of pages5
StatePublished - 1997
EventProceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA - Singapore, Singapore
Duration: 21 Jul 199725 Jul 1997

Conference

ConferenceProceedings of the 1997 6th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IPFA
CitySingapore, Singapore
Period21/07/9725/07/97

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