TY - JOUR
T1 - Simulation of dynamic fracture along solder-pad interfaces using a cohesive zone model
AU - Jing, Jianping
AU - Gao, Feng
AU - Johnson, Janine
AU - Liang, Frank Z.
AU - Williams, Richard L.
AU - Qu, Jianmin
PY - 2009/7
Y1 - 2009/7
N2 - In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder-IMC interface, then moves to IMC-Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC-Cu interface.
AB - In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder-IMC interface, then moves to IMC-Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC-Cu interface.
KW - Cohesive zone
KW - Fracture
KW - Interface
KW - Simulation
KW - Solder
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U2 - 10.1016/j.engfailanal.2008.10.019
DO - 10.1016/j.engfailanal.2008.10.019
M3 - Article
AN - SCOPUS:64649100464
SN - 1350-6307
VL - 16
SP - 1579
EP - 1586
JO - Engineering Failure Analysis
JF - Engineering Failure Analysis
IS - 5
ER -