Simulation of dynamic fracture along solder-pad interfaces using a cohesive zone model

Jianping Jing, Feng Gao, Janine Johnson, Frank Z. Liang, Richard L. Williams, Jianmin Qu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

13 Scopus citations

Abstract

In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder-IMC interface, then moves to IMC-Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC-Cu interface.

Original languageEnglish
Title of host publicationElectronics and Photonics
Pages171-176
Number of pages6
DOIs
StatePublished - 2009
Event2008 ASME International Mechanical Engineering Congress and Exposition, IMECE 2008 - Boston, MA, United States
Duration: 31 Oct 20086 Nov 2008

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings
Volume6

Conference

Conference2008 ASME International Mechanical Engineering Congress and Exposition, IMECE 2008
Country/TerritoryUnited States
CityBoston, MA
Period31/10/086/11/08

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