Simulation of dynamic fracture along solder-pad interfaces using a cohesive zone model

Jianping Jing; Feng Gao; Janine Johnson; Frank Z. Liang; Richard L. Williams; Jianmin Qu

doi:10.1016/j.engfailanal.2008.10.019

Simulation of dynamic fracture along solder-pad interfaces using a cohesive zone model

Jianping Jing
, Feng Gao
, Janine Johnson
, Frank Z. Liang
, Richard L. Williams
, Jianmin Qu

Research output: Contribution to journal › Article › peer-review

37 Scopus citations

Abstract

In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder-IMC interface, then moves to IMC-Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC-Cu interface.

Original language	English
Pages (from-to)	1579-1586
Number of pages	8
Journal	Engineering Failure Analysis
Volume	16
Issue number	5
DOIs	https://doi.org/10.1016/j.engfailanal.2008.10.019
State	Published - Jul 2009

Keywords

Cohesive zone
Fracture
Interface
Simulation
Solder

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10.1016/j.engfailanal.2008.10.019

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title = "Simulation of dynamic fracture along solder-pad interfaces using a cohesive zone model",

abstract = "In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder-IMC interface, then moves to IMC-Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC-Cu interface.",

keywords = "Cohesive zone, Fracture, Interface, Simulation, Solder",

author = "Jianping Jing and Feng Gao and Janine Johnson and Liang, \{Frank Z.\} and Williams, \{Richard L.\} and Jianmin Qu",

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AU - Jing, Jianping

AU - Gao, Feng

AU - Johnson, Janine

AU - Liang, Frank Z.

AU - Williams, Richard L.

AU - Qu, Jianmin

PY - 2009/7

Y1 - 2009/7

N2 - In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder-IMC interface, then moves to IMC-Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC-Cu interface.

AB - In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder-IMC interface, then moves to IMC-Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC-Cu interface.

KW - Cohesive zone

KW - Fracture

KW - Interface

KW - Simulation

KW - Solder

UR - https://www.scopus.com/pages/publications/64649100464

UR - https://www.scopus.com/pages/publications/64649100464#tab=citedBy

U2 - 10.1016/j.engfailanal.2008.10.019

DO - 10.1016/j.engfailanal.2008.10.019

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SP - 1579

EP - 1586

JO - Engineering Failure Analysis

JF - Engineering Failure Analysis

IS - 5

ER -

Simulation of dynamic fracture along solder-pad interfaces using a cohesive zone model

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Keywords

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