Solder fatigue life in two chip scale packages

Qizhou Yao, Jianmin Qu, Sean X. Wu

Research output: Contribution to journalConference articlepeer-review

17 Scopus citations

Abstract

In this paper, two dimensional and three dimensional finite element models have been developed to numerically predict the stress, total strain, plastic strain, and cumulative plastic strain of the solder joints in an ATC 4.1 flip-chip test vehicle, a microBGA, and a Chip Scale Package under temperature cycling. These stress and strain values have been used to predict the solder joint lifetime through either strain-based approaches such as Coffin-Manson and modified Coffin-Manson equations, or stress-based approach (S-N Curve). However, the modified C-M prediction is highly dependent on cycling frequency. Numerical results obtained from the FE models also reveal that both effective total strain and effective plastic strain quickly stabilize after several temperature cycles, and cumulative plastic strain in the outmost solder joint is a linear function of the number of temperature cycling. Results from both strain and stress based approaches show that solder joints in both microBGA and CSP packages have very high fatigue life under prescribed thermal loading. This assures excellent packaging reliability.

Original languageEnglish
Pages (from-to)563-570
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3906
StatePublished - 1999
EventProceedings of the 1999 International Symposium on Microelectronics - Chicago, IL, USA
Duration: 26 Oct 199928 Oct 1999

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