TY - JOUR
T1 - Solder fatigue life in two chip scale packages
AU - Yao, Qizhou
AU - Qu, Jianmin
AU - Wu, Sean X.
PY - 1999
Y1 - 1999
N2 - In this paper, two dimensional and three dimensional finite element models have been developed to numerically predict the stress, total strain, plastic strain, and cumulative plastic strain of the solder joints in an ATC 4.1 flip-chip test vehicle, a microBGA, and a Chip Scale Package under temperature cycling. These stress and strain values have been used to predict the solder joint lifetime through either strain-based approaches such as Coffin-Manson and modified Coffin-Manson equations, or stress-based approach (S-N Curve). However, the modified C-M prediction is highly dependent on cycling frequency. Numerical results obtained from the FE models also reveal that both effective total strain and effective plastic strain quickly stabilize after several temperature cycles, and cumulative plastic strain in the outmost solder joint is a linear function of the number of temperature cycling. Results from both strain and stress based approaches show that solder joints in both microBGA and CSP packages have very high fatigue life under prescribed thermal loading. This assures excellent packaging reliability.
AB - In this paper, two dimensional and three dimensional finite element models have been developed to numerically predict the stress, total strain, plastic strain, and cumulative plastic strain of the solder joints in an ATC 4.1 flip-chip test vehicle, a microBGA, and a Chip Scale Package under temperature cycling. These stress and strain values have been used to predict the solder joint lifetime through either strain-based approaches such as Coffin-Manson and modified Coffin-Manson equations, or stress-based approach (S-N Curve). However, the modified C-M prediction is highly dependent on cycling frequency. Numerical results obtained from the FE models also reveal that both effective total strain and effective plastic strain quickly stabilize after several temperature cycles, and cumulative plastic strain in the outmost solder joint is a linear function of the number of temperature cycling. Results from both strain and stress based approaches show that solder joints in both microBGA and CSP packages have very high fatigue life under prescribed thermal loading. This assures excellent packaging reliability.
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M3 - Conference article
AN - SCOPUS:0033354696
SN - 0277-786X
VL - 3906
SP - 563
EP - 570
JO - Proceedings of SPIE - The International Society for Optical Engineering
JF - Proceedings of SPIE - The International Society for Optical Engineering
T2 - Proceedings of the 1999 International Symposium on Microelectronics
Y2 - 26 October 1999 through 28 October 1999
ER -