SOME MECHANICS ISSUES RELATED TO THE THERMOMECHANICAL RELIABILITY OF FLIP CHIP DCA WITH UNDERFILL ENCAPSULATION

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The objectives of this research were to address some reliability issues in flip chip applications by characterizing the stress and strain response of a flip chip assembly under various loading conditions. In particular, the issue of fundamental limits on chip size was addressed and the importance of appropriate material models and constitutive relationships was assessed. Linear thermoelasticity models, metal plasticity models, viscoelasticity models and creep models were implemented. Finally, parametric studies were performed to optimize some of the elastic properties of the underfill. It has been shown that (1) the chip major dimension is not the limiting factor in determining the maximum chip size for underfilled flip chip interconnections; (2) non-linear material behavior (e.g., creep, viscoplasticity, etc.) and detailed geometry need to be considered in the modeling to accurately predict the stress and strain fields; (3) there is an window for selecting optimal thermal expansion coefficient and modulus values which minimize stress and strain fields in the solder and silicon chip.

Original languageEnglish
Title of host publicationApplication of Fracture Mechanics in Electronic Packaging
Pages85-95
Number of pages11
ISBN (Electronic)9780791818275
DOIs
StatePublished - 1997
EventASME 1997 International Mechanical Engineering Congress and Exposition, IMECE 1997 - Application of Fracture Mechanics in Electronic Packaging - Dallas, United States
Duration: 16 Nov 199721 Nov 1997

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume1997-J

Conference

ConferenceASME 1997 International Mechanical Engineering Congress and Exposition, IMECE 1997 - Application of Fracture Mechanics in Electronic Packaging
Country/TerritoryUnited States
CityDallas
Period16/11/9721/11/97

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