TY - GEN
T1 - Temperature dependence of mechanical properties of individual phases in Sn-3.0Ag-0.5Cu lead-free solder alloy
AU - Gao, Feng
AU - Nishikawa, Hiroshi
AU - Takemoto, Tadashi
AU - Qu, Jianmin
PY - 2008
Y1 - 2008
N2 - The commercial Sn-3.0Ag-0.5Cu (SAC) lead-free solder alloy consists of Sn-rich and eutectic phases. The mechanical properties of these individual phases were demonstrated to be a function of the temperature. The nano-indentation equipment assembled with advanced-controlled hot-stage was utilized to examine the mechanical characteristics. The experiments were performed at 60°C, 80°C, 110°C, 130°C and 150°C, respectively. It was found that for both Sn-rich phase and eutectic phase, the mechanical properties, such as hardness and elastic modulus, exhibited the dependence on the temperature. In particular, the creep deformation at the dwell time of constant target load exhibited high sensitivity to the temperature. Generally, the higher temperature resulted in a larger creep deformation, which in turn impacted the strain rate sensitivity of the individual phases. The Sn-rich phase showed larger creep deformation than that of eutectic phase. However, the much larger strain rate sensitivity index value was obtained for eutectic phase at the lower temperature than 150°0C The activity energy of Sn-rich phase was derived based on the relation of strain rates versus temperature.
AB - The commercial Sn-3.0Ag-0.5Cu (SAC) lead-free solder alloy consists of Sn-rich and eutectic phases. The mechanical properties of these individual phases were demonstrated to be a function of the temperature. The nano-indentation equipment assembled with advanced-controlled hot-stage was utilized to examine the mechanical characteristics. The experiments were performed at 60°C, 80°C, 110°C, 130°C and 150°C, respectively. It was found that for both Sn-rich phase and eutectic phase, the mechanical properties, such as hardness and elastic modulus, exhibited the dependence on the temperature. In particular, the creep deformation at the dwell time of constant target load exhibited high sensitivity to the temperature. Generally, the higher temperature resulted in a larger creep deformation, which in turn impacted the strain rate sensitivity of the individual phases. The Sn-rich phase showed larger creep deformation than that of eutectic phase. However, the much larger strain rate sensitivity index value was obtained for eutectic phase at the lower temperature than 150°0C The activity energy of Sn-rich phase was derived based on the relation of strain rates versus temperature.
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U2 - 10.1109/ECTC.2008.4550013
DO - 10.1109/ECTC.2008.4550013
M3 - Conference contribution
AN - SCOPUS:51349100914
SN - 9781424422302
T3 - Proceedings - Electronic Components and Technology Conference
SP - 466
EP - 471
BT - 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
T2 - 2008 58th Electronic Components and Technology Conference, ECTC
Y2 - 27 May 2008 through 30 May 2008
ER -