The measurement of stress during the deposition of thin films

A. G. Read; J. P.G. Farr; K. G. Sheppard

doi:10.1016/0376-4583(79)90032-3

The measurement of stress during the deposition of thin films

A. G. Read, J. P.G. Farr, K. G. Sheppard

University of Birmingham

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

The deflection of a small cantilever during the deposition of a surface layer on one side is conveniently and sensitively monitored by holographic interferometry. Stresses developing when silver was electroplated onto vapour-metallized semiconductor substrates have been measured using a sequence of lapsed-time holographic interferograms recorded on a single photographic plate. This multi-framing technique, involving screening of the reference beam, has some advantages compared with the real-time technique.

Original language	English
Pages (from-to)	325-331
Number of pages	7
Journal	Surface Technology
Volume	8
Issue number	4
DOIs	https://doi.org/10.1016/0376-4583(79)90032-3
State	Published - Apr 1979

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title = "The measurement of stress during the deposition of thin films",

abstract = "The deflection of a small cantilever during the deposition of a surface layer on one side is conveniently and sensitively monitored by holographic interferometry. Stresses developing when silver was electroplated onto vapour-metallized semiconductor substrates have been measured using a sequence of lapsed-time holographic interferograms recorded on a single photographic plate. This multi-framing technique, involving screening of the reference beam, has some advantages compared with the real-time technique.",

author = "Read, {A. G.} and Farr, {J. P.G.} and Sheppard, {K. G.}",

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N2 - The deflection of a small cantilever during the deposition of a surface layer on one side is conveniently and sensitively monitored by holographic interferometry. Stresses developing when silver was electroplated onto vapour-metallized semiconductor substrates have been measured using a sequence of lapsed-time holographic interferograms recorded on a single photographic plate. This multi-framing technique, involving screening of the reference beam, has some advantages compared with the real-time technique.

AB - The deflection of a small cantilever during the deposition of a surface layer on one side is conveniently and sensitively monitored by holographic interferometry. Stresses developing when silver was electroplated onto vapour-metallized semiconductor substrates have been measured using a sequence of lapsed-time holographic interferograms recorded on a single photographic plate. This multi-framing technique, involving screening of the reference beam, has some advantages compared with the real-time technique.

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JO - Surface Technology

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The measurement of stress during the deposition of thin films

Abstract

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