Thermomechanical fatigue life of Chip Scale Packages

Qizhou Yao, Jianmin Qu, Scan X. Wu

Research output: Contribution to conferencePaperpeer-review

1 Scopus citations

Abstract

In this paper, two three dimensional finite element models were developed to numerically compute the stress, total strain, plastic strain, and the cumulative plastic strain of the solder joints in a microBGA and a Chip Scale Package (CSP) under temperature cycling. These stress and strain values, along with the results of solder fatigue tests, were then used to predict the solder joint lifetime through either strain-based approaches such as Coffin-Manson and modified Coffin-Manson equations, or stress-based approach (S-N Curve). Particular attention was given to the complex temperature profile of the thermal loading. The estimated fatigue life for both packages are extremely high, indicating that the packages are well designed for thermomechanical reliability.

Original languageEnglish
Pages2/-
StatePublished - 1999
EventInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA
Duration: 13 Jun 199919 Jun 1999

Conference

ConferenceInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999'
CityMaui, HI, USA
Period13/06/9919/06/99

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