Original language | English |
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Title of host publication | Comprehensive Structural Integrity |
Pages | V8-363-V8-383 |
ISBN (Electronic) | 9780323919456 |
DOIs | |
State | Published - 1 Jan 2023 |
Thermomechanical Reliability of Microelectronic Packaging
Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review