Thermomechanical Reliability of Microelectronic Packaging

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

Original language	English
Title of host publication	Comprehensive Structural Integrity
Pages	V8-363-V8-383
ISBN (Electronic)	9780323919456
DOIs	https://doi.org/10.1016/B978-0-12-822944-6.00161-4
State	Published - 1 Jan 2023

Access to Document

TY - CHAP

T1 - Thermomechanical Reliability of Microelectronic Packaging

AU - QU, J.

PY - 2023/1/1

Y1 - 2023/1/1

UR - https://www.scopus.com/pages/publications/85173335254

UR - https://www.scopus.com/inward/citedby.url?scp=85173335254&partnerID=8YFLogxK

U2 - 10.1016/B978-0-12-822944-6.00161-4

DO - 10.1016/B978-0-12-822944-6.00161-4

M3 - Chapter

AN - SCOPUS:85173335254

SP - V8-363-V8-383

BT - Comprehensive Structural Integrity

ER -