Thermomechanical stresses in an underfilled flip chip DCA

C. A. Le Gall, J. Qu, D. L. McDowell

Research output: Contribution to conferencePaperpeer-review

8 Scopus citations

Abstract

A general methodology is developed to conduct stress analysis in flip-chip DCA with underfill encapsulation using the finite element method. In particular, two fundamental issues are addressed, namely, effects of die size on the stress fields and the optimization of thermomechanical properties of underfill materials. It is shown that the nature of stress fields in underfilled flip chips is fundamentally different from that in any other surface mount assemblies. The distance to neutral point (DNP) is no longer a dominant factor in determining the magnitude of the stresses in underfilled flip-chip packages. Consequently, as far as the stresses are concerned, the die size is not a limiting factor.

Original languageEnglish
Pages128-129
Number of pages2
StatePublished - 1997
EventProceedings of the 1997 3rd International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA
Duration: 9 Mar 199712 Mar 1997

Conference

ConferenceProceedings of the 1997 3rd International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
CityBraselton, GA, USA
Period9/03/9712/03/97

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