Abstract
A general methodology is developed to conduct stress analysis in flip-chip DCA with underfill encapsulation using the finite element method. In particular, two fundamental issues are addressed, namely, effects of die size on the stress fields and the optimization of thermomechanical properties of underfill materials. It is shown that the nature of stress fields in underfilled flip chips is fundamentally different from that in any other surface mount assemblies. The distance to neutral point (DNP) is no longer a dominant factor in determining the magnitude of the stresses in underfilled flip-chip packages. Consequently, as far as the stresses are concerned, the die size is not a limiting factor.
Original language | English |
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Pages | 128-129 |
Number of pages | 2 |
State | Published - 1997 |
Event | Proceedings of the 1997 3rd International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA Duration: 9 Mar 1997 → 12 Mar 1997 |
Conference
Conference | Proceedings of the 1997 3rd International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces |
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City | Braselton, GA, USA |
Period | 9/03/97 → 12/03/97 |