THREE-DIMENSIONAL FINITE ELEMENT MODELING OF FLIP CHIP PACKAGES UNDER THERMAL LOADING

Qizhou Yao, Jianmin Qu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Fingerprint

Dive into the research topics of 'THREE-DIMENSIONAL FINITE ELEMENT MODELING OF FLIP CHIP PACKAGES UNDER THERMAL LOADING'. Together they form a unique fingerprint.

Engineering

Physics

Computer Science